New product development process.
New product development is a process which is designed to
develop, test and consider the viability of products which are new to the
market in order to ensure the growth or survival of the organization.
-
Conducting marketing
research to find out the consumers' needs and wants.
-
Inviting suggestions
from consumers.
-
Inviting suggestions
from employees.
-
Brainstorming
suggestions for new-product ideas.
-
Searching in
different markets viz., national and international markets for new-product
ideas.
-
Getting feedback from
agents or dealers about services offered by competitors.
-
Studying the new
products of the competitors.
2.
Idea screening:
This process involves shifting through the ideas generated above and selecting
ones which are feasible and workable to develop. It is the process of eliminating unfeasible
ideas. The ideas are screened in terms of organizations objectives, policies,
resources and technical capabilities. Ideas can be promising, marginal and
rejected ones. Promising ideas are evaluated for consideration in the next
stage. Marginal ideas are stored for future uses. Rejected ideas are dropped.
Concept testing is done after idea screening. It is different from test marketing.
In this stage of concept testing, the company finds out:
Whether the consumers understand the product idea or not?
Whether the consumers need the new product or not?
Whether the consumers will accept the product or not?
Whether the consumers understand the product idea or not?
Whether the consumers need the new product or not?
Whether the consumers will accept the product or not?
Here, a small group of consumers is
selected. They are given full information about the new product. Then they are
asked what they feel about the new product. They are asked whether they like
the new product or not. So, concept testing is done to find out the consumers'
reactions towards the new product. If most of the consumers like the product, then
business analysis is done.
4.
Marketing strategy and business analysis:
a. Marketing strategy: a preliminary marketing strategy for the selected project concept is developed. It covers
-target market for the product
-product positioning strategy
a. Marketing strategy: a preliminary marketing strategy for the selected project concept is developed. It covers
-target market for the product
-product positioning strategy
-estimates
of market share
-marketing budget
-marketing mix
b. business analysis: a business analysis is done to evaluate the product concept’s business attractiveness. It involve:
-competitor analysis
-marketing budget
-marketing mix
b. business analysis: a business analysis is done to evaluate the product concept’s business attractiveness. It involve:
-competitor analysis
-demand
forecasts
-cost
statement and break-even analysis to estimate costs
-profit
projections
If
the product concept passes the marketing strategy and business analysis test,
it moves to the next stage of product development.
5.
Product development:
At this stage the prototype is produced. The product concept is developed into
physical product. Functional tests under lab and field conditions are conducted
to see that the product performs safely and effectively.
Test marketing reduces the risk of large-scale marketing. It is a safety
device. It is very time-consuming. It must be done especially for costly
products.
7.
Commercialization
If
the test marketing is successful, then the company introduces the new product
on a large scale, say all over the country. The company makes a large
investment in the new product. It produces and distributes the new product on a
huge scale. It advertises the new product on the mass media like TV, Radio,
Newspapers and Magazines, etc.
With regard to packaging and assembly, in most cases, the wafer will first need to be singulated into individual die. It is critical that you know the dicing method that will be used to singulate your wafer before you design your wafer-level layout. The method will determine the spacing, or streets, required between die. If not planned appropriately, your die could end up smaller or larger than desired, or even worse, you could lose functional components on the die. For mask layout purposes, in traditional saw dicing, dicing blades can take 18μm to 100μm of material from the wafer (known as the dicing or saw kerf). The blade thickness is selected based on the wafer material type and thickness. In plasma dicing, the dicing kerf is determined by the allowable aspect ratio of the etch process. Stealth dicing is a zero-kerf process; however, a dicing lane free of materials that block IR laser light is required. strategy thought leadership
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